레이저를 이용한 커팅은 매우 정밀하며 절단면의 RA값이 좋아 초미세 가공 공정에서 필수적입니다.
|
|
•Glass
| Laser |
pico second 355nm Laser
|
|
material
|
Golila Glass(none coating)
|
|
thickness
|
1mm
|
|
process
|
laser cutting
|
|
RA(Roughness Average)
|
0.1
|
|
process speed
|
1m/s
|
|
|
|
•Glass
| Laser |
pico second 355nm Laser
|
|
material
|
Golila Glass(at coating)
|
|
thickness
|
1mm
|
|
process
|
laser cutting
|
|
RA(Roughness Average)
|
0.2
|
|
process speed
|
1m/s
|
|
|
|
•metal
| Laser |
pico second 1064nm Laser
|
|
material
|
steinless 304
|
|
thickness
|
1mm
|
|
process
|
laser cutting
|
|
Heat Effect Area
|
150um
|
|
process speed
|
0.1m/s
|
|
 |
•plastic
| Laser |
pico second 355nm Laser
|
|
material
|
polyimde
|
|
thickness
|
1mm
|
|
process
|
laser cutting
|
|
Heat Effect Area
|
100um
|
|
process speed
|
1m/s
|
|
|
|
•By Femto Laser
| Laser |
pico second 355nm Laser
|
|
material
|
Rigid PCB
|
|
thickness
|
1.6mm(8 layer)
|
|
process
|
laser cutting
|
|
Heat Effect Area
|
50um
(No Burning, No Delamination)
|
|
process speed
|
1m/s
|
|
